Optical alignment system BGA rework station WDS-700 for motherboard Iphone/Samsung/HTC rework IC BGA repair machine

Optical alignment system BGA rework station WDS-700 for motherboard Iphone/Samsung/HTC rework IC BGA repair machine

Product Describable

    Our BGA Rework Station/ BGA reballing station are widely used to replace and repair the BGA chip in laptop, mobile phone, xbox360,ps3,etc. The main user is repairing shops and factory to provide the after-sales service and rework.

Repair steps:
1) Separate the BGA chip from mother board –we called desoldering
2) Clean Pad
3) Reballing or replace a new BGA chip directly
4) Alignment/Positioning – Depend on experience ,silk frame ,optical camera
5) replace a new BGA chip - we called Soldering

Product Application
BGA rework station could be used in : 
Laptop / Notebook/ Computer motherboard repair. 
Playstation / XBOX 360 and other game console repair. 
Iphone 4/ 4s / 5 / 5s motherboard repair. 
TV / Video / ipad mainboard repai. 
SMD/ SMT / IC BGA rework

Parameter of WDS-700 IC replacement machine
Original Place	Brand Name	Wisdomshow chip reballing machine
	Mode Number	WDS-700 IC replacement machine
	Superior  Function	Soldering and desoldering bga chip
Parameter of  WDS-700 smartphone  repair  machine	Power	AC 220V ± 10%  50/60Hz
	Total Power	Max  2500W
	Heater power	upper temp zone 1200W, second temp zoom 1200W .
	Temperature Controlling	K-type thermocouple close-loop control,   Independent temp,controller, the precision can reach ±1℃
	PCB size	Max: 140x 160mm. Min 5x5mm
	Applicable chips	Max: 80*80mm  Min 1x1mm

pls contact me :

whatsapp : +86 13043470536